Tuesday, July 8, 2009
Silex Microsystems has shipped the first wafers from the new 8-inch wafer MEMS fab to its foundry customers. Despite the industry downturn, Silex has shown its commitment to supporting the expansion of its facilities in Sweden with a brand new state-of-the-art 8-inch manufacturing line.
“This testifies Silex’ strong financial position and commitment to providing a future proof volume supply to our customers. The addition of the 8-inch production facility also has potential for major MEMS users poised to outsource their manufacturing” says Edvard Kälvesten COO and founder of Silex Microsystems.
Chips produced on 8-inch wafers will be made using the most advanced 0.5 micron lithography process and contain complete MEMS processes for fabrication of Silex standard process platforms including high vacuum wafer bonding, high aspect ratio DRIE etching and electroplating. An 8-inch wafer features a 78 percent larger surface area compared to 6-inch wafers meaning lower production costs for high volume manufacturing.
Another significant advantage is the integration of MEMS with CMOS. As the main portion of CMOS manufacturing is carried out on 8-inch wafer size, Silex 8-inch wafer full MEMS capability enables MEMS based functional capping and wafer level integration of MEMS and CMOS. In order to support the growing industry requirements for 3D integration, Silex has developed a suite of process platforms primarily based on Silex proprietary via and wafer bonding technologies. To serve foundry customers with low resistivity interconnect specifications, typically in the RF MEMS domain, Silex has over the past years worked on developing a metal-via process suitable to meet the stringent requirements of sub 50 mOhm total through wafer via resistance in combination with tough demands on hermeticity. Silex new 8” line is boasting a world leading equipment installation base that combined with Silex processing expertise offers the best metal via solutions available on the market today.
Silex’ new 8-inch fab at Järfälla, near Stockholm in Sweden, is one of the most modern in the world. It is equipped with state-of-the-art MEMS processing equipment, such as EVG Gemini wafer bonders and Applied Materials manufacturing equipment for all etch applications, dielectric CVD, Al PVD and Cu barrier/seed as well as Semitool Paragon plating systems. Its current capacity is in the order of 10 000 eight 8-inch wafers per month.
