Tuesday, November 24, 2009
Silex Microsystems, a MEMS foundry based in Järfälla Sweden, launched what it is calling its metal via capping technology (Met-Cap™). Met-Cap™ is the latest in a line-up of advanced trough silicon via process platforms from Silex suitable to meet the most stringent wafer level capping applications. The company states that the new platform unveiled has achieved the total resistance levels required for implementation in RF applications. Silex Met-Cap™ technology utilizes licensed metal via technology from AAC Microtec (XiVIA®) to solve the inherent reliability issues relating to thermal mismatch of metals and standard wafer substrates. Silex Cu based Met-Cap™ solution exhibits a total yield <25 mOhm per via in 300 µm thick wafer substrates.
“To help our customers take full advantage of the MEMS technology, we have complemented our foundry manufacturing with next generation process platforms” said Jan Nerdal, CEO of Silex Microsystems”. “It is a cornerstone in our strategy to be able to offer our customers well characterized standard process platform that reduces development cost, risk and time to market. And being a pure play MEMS foundry we see more applications for 3D integration beyond the classical stacking of IC’s. Many MEMS applications are poised to move to wafer level packaging” said Jan Nerdal.
