News

23 Jan/14

Silex Wins Best Paper Award at IWLPC

    SMTA and Chip Scale Review magazine, co-organizers of the International Wafer-Level Packaging Conference (IWLPC), announced the Best of Conference papers from the event held November 5-7, 2013 [...]

01 Jul/13

MEMS for Micromachining

Commercial Micro Manufacturing recently interviewed Silex's Tomas Bauer about how MEMS brings new capabilities and enhanced manufacturing options to the world of micromachining. This article is a great overview of [...]

09 Mar/13

Silex TSI Technology featured in SolidState Technology

Silex Microsystems' Through-Silicon Insulation or TSI technology was highlighted in the March 2013 issue of SolidState Technology. This article is a great overview of Silex technology and how TSI forms [...]

10 Jan/13

RocketMEMS Interview on EE Journal’s FishFry

Peter Himes, from Silex Microsystems, and Alissa Fitzgerald of AMFitzgerald & Asociates, were interviewed by Amelia Dalton of EE Journal to discuss the recently announced RocketMEMS program, the new initiative [...]

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