Foundry Capabilities

Experts in Taking Customers from Concept to Production

People come to Silex because we have a proven ability to develop high quality and robust MEMS processes as well as successfully ramp up to cost-efficient high volume manufacturing. Our customers benefit from our industry-leading expertise in MEMS construction, design adaptation and innovative manufacturing processes including:

  • Reliable, high-volume foundry services
  • State of the art tools, equipment and processes
  • Industry’s most advanced MEMS and heterogeneous wafer-level packaging
  • Access to a global ecosystem of development partners

Silex’s team of experts has an impressive breadth of specialized knowledge and experience in the set-up and manufacturing of customized MEMS solutions. Beginning by gaining a thorough understanding of your needs, we collaborate with you to ensure that your designs are robust and production ready, saving valuable time and resources.

Proven, High Volume 6” and 8” Fabs

Our production operations—totaling 2.200 square meters — house dedicated lines for both 6” and 8” wafers, both of which are ISO9001:2008 certified and provide customers with not only access to rapid prototyping but also a well proven strategic plan to volume manufacturing.

Our 6” fab has been operating in volume since 2004 with a current capacity of 400,000 litho moves per year and the 8” fab, established in 2009, adds another 500,000 litho moves to our overall capability. And to meet our customers’ evolving needs, we are dedicated to continued investment in next-generation equipment, tools and foundry facilities for high-volume MEMS manufacturing.

State-of-the-Art 8” MEMS Foundry

Silex is the first pure-play MEMS foundry to offer its customers a Class 1-10 200mm fab, with state of the art equipment and capabilities. Committed to meeting our customers’ expectations today and into the future, we provide the industry’s most advanced process technologies in combination with state-of-the-art tool capability.

Our standard processes include proven technologies and proprietary processes such as the Silex Sil-Via® TSV and Zero-Crosstalk™ isolating substrate. Incorporating state-of-the-art deposition and electroplating equipment in our 8-inch fab enables us to offer unique functional capping technologies with integrated through-wafer metal vias, RF passives and coaxial feedthroughs—advanced technologies that are spearheading the MEMS industry in CMOS-to-MEMS integration.

Fully Equipped 6” MEMS Foundry

Silex’s fully equipped, state-of-the-art 6-inch (150 mm) class 10-10000 wafer manufacturing facility is ISO 9001:2000 certified. Our 6” fab has been operating in volume since 2004 with a current capacity of 400,000 litho moves per year and includes:

  • DRIE
  • Furnace
  • Dry and Wet Etch
  • Plasma
  • Lithography
  • Wafer Bond
  • Dicing
  • SEM
  • Electrical Testing