the IEEE 3DIC show will be held in San Francisco this coming October 2-4, and Silex will both be giving a paper on our advanced TSVs for RF MEMS, and exhibiting at the show to meet and discuss the latest in MEMS technologies. For all of you interested in 2.5D integration, wafer level packaging, interposer solutions for IC packaging, and how to get started working with Silex, stop by and introduce yourself!

« Back